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HEAT TRANSFER IN MICROSCALE COMPRESSION MOLDING
Project:
Heat transfer in high temperature instrumented microscale compression
molding
Sponsor:
University: LSU, Mechanical Engineering
Principal Investigator: Dr. W. J. Meng, Professor Michael Khonsari
Graduate Students: Susheel Brahmeshwarkar
Contact Information: Professor Michael Khonsari
Project Description:
Nickel micro scale
inserts with diameter of the order of and length are used for compression
molding of Pb plates with LiGA at a temperature range of 100-3000C.
A transient heat transfer analysis is helpful for elucidating possible
thermal influences when the inserts and the metal have different temperatures.The
heat transfer is dominated by conduction between the moving Nickel insert
and the mold plate. Research is being conducted to determine the temperature
distribution of the insert as a function of time. Both analytical and
numerical solutions are used to simulate the actual problem. The profiles
of temperature variation along the geometry of the inserts give interesting
insights into the values of the mechanical properties like the yield stress
along the geometry.
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Fig. 1 Apparatus Used and Fig. 2 Punched panels Main Objective: 1. To simulate the temperature distribution
in the Ni inserts as function of time. The temperature profiles at different locations can be plotted as follows:
Fig. 3 Numerical Solution using ADI method (Temperature variation along height)
Fig. 4 Numerical Solution using ADI method (Temperature variation along radius) |
